Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, today announced its participa ...

The Fabrinet presentation is scheduled for Monday, May 18, 2026 at 11:05 a.m. EDT (8:05 a.m. PDT). A live webcast, as well as a replay, will be accessible at https://investor.fabrinet.com/.

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...

SEMI Summit in Dresden highlights AI chiplets, hybrid bonding and Europe’s push for advanced semiconductor packaging.

Terence Gan, Executive Director of Singapore's A*STAR Institute of Microelectronics (A*STAR IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging. The forum ...

Shares of Intel INTC rose on Monday amid growing optimism that the chipmaker could secure a significant new customer for its ...

Taiwan Semiconductor Manufacturing (TSMC) said it plans to open an advanced chip packaging facility in Arizona by 2029, ...