Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...

Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of equipment and consumables enabling AI semiconductor device packaging and advanced substrate fabrication, today announced its participa ...

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and ...

(MENAFN- GetNews) Smart Weigh Packaging Machinery Co., Ltd., a global manufacturer of high-precision weighing and integrated packaging systems, has announced its participation in Interpack 2026, one ...

Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging ...

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it’s also straining some EDA tools and methodologies and creating ...

CEO William John Miller reported, "Veeco delivered strong financial performance, exceeding the high end of our guidance. Revenue totaled $166 million, non-GAAP operating income of $23 million and ...

TSMC says the global semiconductor market could cross $1.5 trillion by 2030 as AI drives demand for advanced chips and ...

Amkor Technology's communications business is gaining from resilient premium smartphone demand as advanced packaging expands across Asia with deeper on-device A ...