TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Taiwan Semiconductor Manufacturing Company (TSM) is up 40% in 2026 alone as investors price in a much larger chip market and ...

India’s chip ambitions are moving beyond fabs toward advanced packaging, glass substrates, and chiplets technologies that ...

Can KLA's AI-driven packaging boom and rising chip complexity power advanced packaging revenues to $1B by 2026?

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in data centers.

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis (FA) technology.

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

The semiconductor equipment industry is entering 2026 with a stronger demand backdrop than the broader cyclical slump of 2022 ...