Digi Times

Aveni extends copper interconnects to 5nm and below for BEOL integration

Aveni, a developer and manufacturer of wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, has announced it has obtained results that support the ...
Business Insider

aveni® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating ChemistryRecent findings validate that the company’s Sao ...

MASSY, France, Dec. 12, 2017 (GLOBE NEWSWIRE) -- aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via ...
Semiconductor Engineering

A Comprehensive Study Of Integrating 2D Materials With CFET Architecture (SKKU, et al.)

A new technical paper, “Challenges and prospects of 2D electronics for future monolithic complementary field-effect ...
Semiconductor Engineering

BEOL Barricades Ahead

Coventor recently assembled an expert panel at IEDM 2016, to discuss changes to BEOL process technology that would be needed to continue dimensional scaling to 7 nm and lower. Among the questions ...
EurekAlert!

In-situ lanthanum doping enables BEOL-compatible HfO2 ferroelectric capacitors with low-voltage operation and high reliability

Hafnium-based FE materials have attracted particular interest owing to their low power consumption, strong compatibility with complementary metal-oxide-semiconductor (CMOS) processes and proven ...