To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidity and circuit miniaturization for next-gen data centers, AI, and ASIC packaging Built from Kyocera’s ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in data centers.

As package sizes grow, warpage can become a real headache. A ceramic approach can offer rigidity where traditional materials ...

Themed "The Future of the Core", the conference emphasized the continued development and innovations of electronic atomization technology, as well as demonstrating ICCPP's determination to shape the ...

SHENZHEN, China, Sept. 17. /PRNewswire/ ICCPP, a global atomization company, has unveiled its first-ever ceramic core technology brand GENE TREE at the 2021 Nano-tech Ceramic Core Global Online Launch ...

SHENZHEN, China, Sept. 17, 2021 /PRNewswire/ -- ICCPP, a global atomization company, has unveiled its first-ever ceramic core technology brand GENE TREE at the 2021 Nano-tech Ceramic Core Global ...