A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in ...

A new method of nickel-gold plating uses chemicals rather than the more-commonly used electricity-based approach of passing electric current between a substrate and conductive solution. The new ...

Materials to make hard-wearing, bendable non-conducting substrates for wearables and other flexible electronics are essential for the next generation of integrated devices. In this vein, researchers ...

Aerosol deposition (AD) methods have emerged as a transformative approach for fabricating both thin and thick films entirely at room temperature. By utilising aerosolised powders propelled onto ...

CeramTec's experience in manufacturing ceramic products goes back to the earliest days of electronics. Since then, they have evolved into a leading manufacturer of aluminum oxide and aluminum nitride ...

Silicon nitride ceramic substrates play a pivotal role in Active Metal Brazing (AMB) substrates for power modules whose applications include inverters for electric vehicle (EV) and hybrid electric ...