South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging ...

TSMC has introduced its A13 and N2U chipmaking processes, aiming for smaller, faster chips without costly new ASML equipment, and announced plans for an advanced packaging plant in Arizona by 2029.

Shares of Intel INTC rose on Monday amid growing optimism that the chipmaker could secure a significant new customer for its ...

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...

NYSE Composite highlights Taiwan Semiconductor Manufacturing Company through semiconductor sector expansion, artificial ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

The deal aims to strengthen panel-level packaging capabilities for AI chip production and accelerate the adoption of ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

Three OSAT facilities are operational in Gujarat's Sanand. ThePrint visited two of them, & found engineering graduates ...

The semiconductor equipment industry is entering 2026 with a stronger demand backdrop than the broader cyclical slump of 2022 ...