Grinding, or abrasive machining, is the process of removing metal in the form of minute chips by the action of irregularly shaped abrasive particles. These particles may be in bonded wheels, coated ...

Lapping is a final abrasive finishing operation that produces extreme dimensional accuracy, corrects minor imperfections of shape, refines surface finish and produces close fit between mating surfaces ...

Device level SiC wafers require a systematic process including single crystal growth, wire cutting, lapping or grinding, and chemical mechanical polishing. SiC wafers have important application value ...