What are the qualifications of the people conducting IDTechEx research? Content produced by IDTechEx is researched and written by our technical analysts, each with a PhD or master's degree in their ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of ...

Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging ...

New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...

According to Dr. Richard Thurston, CEO of GLS, the partnership leverages both companies' technology portfolios by tightly integrating GLS's proprietary chip fabrication processes with advanced ...

Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates for ...

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis (FA) technology.

MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Taiwan Semiconductor Manufacturing Co. plans to open an advanced chip packaging facility in Arizona before 2029, adding CoWoS and 3D-IC capabilities critical for AI chips used by Nvidia and Apple. The ...

HANOI, Vietnam, Jan. 29, 2026 /PRNewswire/ --On January 28, 2026, in Hanoi, FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming ...