While the Universal Chiplet Interconnect Express (UCIe) standard for die-to-die interconnect is getting a lot of attention, significant work is also being carried out on another design front: ...
ARLINGTON, Va.--(BUSINESS WIRE)--In an extraordinary leap forward for the chiplet industry, the groundbreaking collaboration between the Open Compute Project Foundation (OCP) and JEDEC is set to usher ...
ARLINGTON, Va., USA – APRIL 17, 2024 – JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced publication of the JESD79 ...
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