South Korean electronics manufacturer LG Innotek arrived in Orlando, Florida this week to court North American chip designers ...
Tesla’s AI substrate push has reportedly drawn LG Innotek into a challenge to Samsung, putting FC-BGA packaging and ...
To capitalize on the demand for generative AI, Toppan Holdings (formerly Toppan Printing) reportedly plans to invest approximately JPY60 billion (US$403 million) to expand the production capacity of ...
LG Innotek is seeking to enter Tesla's AI semiconductor supply chain by targeting ABF-based FC-BGA substrate orders for the ...
Samsung Electro-Mechanics will supply semiconductor substrates to Nvidia. On the 8th, industry sources said Nvidia's Groq 3 language processing unit (LPU) uses flip-chip ball grid array (FC-BGA) made ...
Samsung Electro-Mechanics is said to be planning a large-scale investment in Vietnam to strengthen its semiconductor substrate production capacity. According to Bloomberg and others on the 14th, ...
Shennan Circuits disclosed its investor relations activity record. The PCB business benefited from growing demand for AI computing infrastructure hard ...
The artificial intelligence capital spending boom has spilled past memory and logic chips into the component tier of the ...
Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...
On May 5, NH Investment & Securities raised its target price for Samsung Electro-Mechanics from 600,000 won to 1,000,000 won, ...
The Package Solutions division, which produces flip-chip ball grid array (FC-BGA) substrates, reported the most significant increase among the company’s business lines. Sales for this segment rose 45 ...
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