SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...
FREUDENSTADT, Germany, March 04, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (SHMD) has successfully delivered the first specialized InfinityLine H+ system designed for Panel-Level Packaging (PLP) ...
FREUDENSTADT, GERMANY – Schmid has introduced its Any Layer Embedded Trace (ET) process, a panel-level manufacturing platform designed to support next-generation advanced packaging as AI and ...
Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...
A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...
FREUDENSTADT, Germany, Oct. 08, 2025 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a leading global provider of equipment and solutions for the electronics industry, today announced the shipment of ...
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