Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit potentials of ...

Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor materials business briefing held in Tokyo on July 15, 2025. The company aims ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...

As geopolitical tensions in the Middle East show signs of easing, market sentiment across Asia has been buoyed by stronger-than-expected economic data from China and a general optimism in global ...

The semiconductor industry continually pushes the boundaries of device performance through advanced process modelling and epitaxial growth techniques. In this context, sophisticated simulation methods ...

TL;DR: Samsung aims to develop 1nm semiconductor technology by 2030 using innovative fork sheet technology to enhance transistor density, competing directly with TSMC. Meanwhile, Samsung plans to ...

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...

The ACM PECVD SiCN system is configured for 300-millimeter wafer processing, supports process temperatures up to 400 degrees Celsius (°C), and features four load ports and three process chambers to ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...