Temperature adds another challenge. Standard DFT is essentially a zero-temperature approach, so thermal effects must be ...

For the data center, chiplet economics matter, but they’re not a primary decision-driver. With the exception of processor families, chiplets cannot address consumer markets today, where economics ...

Sustaining AI progress requires energy-efficient computing with holistic co-design and co-optimization across the entire ...

As chips become more complex and packaging options multiply, designers have more choices than ever for connecting system ...

Mr. Huang got his Ph. D. in 1982 in the area of logic synthesis. He was the co-founder of Gateway Design Automation, Inc. with Dr. Prabhu Goel . Huang and Phil Moorby worked on the language definition ...

Multi-die assemblies are facing full system-level challenges, but engineering teams need coordinated and repeatable ways to ...

A vision-language-action model is an end-to-end neural network that takes sensor inputs—camera images, joint positions, ...

Multi-die assemblies greatly increase the number of things that can go wrong, and the difficulty of finding them.

A new HBF 3D flash stack is similar to HBM for use in AI processing. HBF capacity will be much higher, allowing static ...

Last month we discussed how all interconnects will be optical in the data center in five years, but that’s only part of the ...

The promise of smart test is a data-chain problem before it is an algorithm problem. A device can pass every checkpoint and ...

While transistors see continuous improvement, wires keep getting worse because of the smaller geometries and larger chip ...