Shares of Intel INTC rose on Monday amid growing optimism that the chipmaker could secure a significant new customer for its ...

India advanced its semiconductor push as Ashwini Vaishnaw and Mohan Charan Majhi laid the foundation stone for the country’s first 3D glass semiconductor packaging unit at Info Valley, Bhubaneswar, ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by the ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

Launched in 2021, ISM 1.0 was conceived as a state-backed push to build a full-stack chip ecosystem. The FM announced ISM 2.0 ...

In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...