AZoM speaks to Empower Materials to find out the A-Z of QPAC polymer binders in semiconductor and AlN fabrication.
A new 3D glass printing process developed at Karlsruhe Institute of Technology (KIT), Germany, produces nanometer-fine quartz glass structures that can be printed directly onto semiconductor chips. A ...
Field-assisted sintering technology has revolutionized materials processing by integrating temperature, mechanical, and electrical fields to achieve unprecedented densification efficiency and ...
Microwave cold sintering process (MW-CSP) was used to densify NaCl, KDP, MgMoO₄, Li₂MoO₄, and TiO₂ ceramics. Under the fundamental densification mechanisms dominated by the coupling of the transient ...
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...
A new process developed by researchers in Germany allows for the 3D printing of glass from pure silicon dioxide without the need for sintering. The invention paves the way for the printing of glass ...
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Advanced ceramics manufacturing process
Learn the complete advanced ceramics manufacturing process, including debinding and vacuum sintering. Improve quality with high-performance vacuum furnaces.IntroductionAdvanced ceramics are widely ...
MELVILLE, N.Y., April 8, 2021 /PRNewswire/ -- Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option for ...
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