SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Customers and collaborators will have early access to next-generation glass substrate tools and software solutions to accelerate panel-level packaging R&D WILMINGTON, Mass.--(BUSINESS WIRE)--Onto ...

The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...

Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers can ...

Geneva (Switzerland) and Bernin (France), December 1, 2022 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec ...

As technology nodes shrink, end users are designing systems where each chip element is being targeted for a specific technology and manufacturing node. While designing chip functionality to address ...

IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

Stanford spin-out says it can halve the cost of semiconductor wafers on which high-efficiency power electronics are made. Halo Industries, a California-based startup company with a novel, laser-based, ...