Researchers have designed a robust image-based anomaly detection (AD) framework with illumination enhancement and noise suppression features that can enhance the detection of subtle defects in ...

A new wafer inspection platform combines AI analytics, sub-micron imaging, SWIR sensing, and precision metrology to help ...

Test Research, Inc. has introduced the TR7950Q SII Series, an AI-powered wafer inspection and metrology platform designed for advanced packaging and back-end semiconductor processes. The system offers ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...

The main objective of this project is to let students apply the image processing techniques that been taught in class in a given conditions based on their title. This particular project involved the ...