TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Taiwan Semiconductor Manufacturing Company (TSM) is up 40% in 2026 alone as investors price in a much larger chip market and ...

India’s chip ambitions are moving beyond fabs toward advanced packaging, glass substrates, and chiplets technologies that ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...

Can KLA's AI-driven packaging boom and rising chip complexity power advanced packaging revenues to $1B by 2026?

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in data centers.

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis (FA) technology.

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

The semiconductor equipment industry is entering 2026 with a stronger demand backdrop than the broader cyclical slump of 2022 ...