Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

KAOHSIUNG, April 15, 2026 /PRNewswire/ -- E&R Engineering Corp. (8027.TW), a leading provider of innovative semiconductor process equipment, will participate in the International Semiconductor ...

India’s chip ambitions are moving beyond fabs toward advanced packaging, glass substrates, and chiplets technologies that ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in data centers.

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter ...

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

As India is moving to become a semiconductor manufacturing hub, the industry is poised to generate 1 million jobs across ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

Amid rising supply chain risk and geopolitical uncertainty, attention is turning to regional capability as the semiconductor ...