CARLSBAD, Calif.--(BUSINESS WIRE)-- Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) ...
Applied Materials (NasdaqGS:AMAT) is acquiring ASMPT's NEXX business, adding advanced panel level packaging tools to its ...
In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...
Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...
SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its ...
Breakthrough yield and device performance at high volume show team can scale company's large-format advanced packaging for customers' cutting-edge applications SINGAPORE, SG / ACCESS Newswire / ...
Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible with conventional ...
TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically ...
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SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced ...
Applied Materials, Inc. today announced it has entered into a definitive agreement with ASMPT Limited (HKEX: 0522) to acquire its NEXX business, a leading supplier of large-area advanced packaging ...
Applied Materials will acquire NEXX from ASMPT Limited to enhance its panel-level advanced packaging technology for AI accelerators. The acquisition, which does not require regulatory approval, will ...